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murata manufacturing co., ltd. chip trimmer potentiometer application manual r82e2.pdf 97.09.29 this is the pdf file of catalog no.r82e-2. www.datasheet www.datasheet www.datasheet www.datasheet 4u 4u4u 4u .com .com .com .com
r82e2.pdf 97.09.29 1 this is the pdf file of catalog no.r82e-2. contents 1 features and specifications 2 1. features of murata chip trimmer potentiometers 2 2. specifications ????????????????????????????????????????????????????????????? 4 2 storage 5 1. precautions in storage ????????????????????????????????????????????????? 5 3 design of printed circuit boards 6 1. considerations in design 6 2. standard land patterns 6 4 typical chip mounting processes 9 1. one side chip mounting 9 2. both side chip mounting 9 3. mixed mounting of chip components and leaded components 9 5 chip mounting process 10 1. solder paste stenciling 10 2. mounting the product 10 3. compatibility with chip placers 11 4. sensor level adjustment 12 5. reflow soldering 12 6. adhesive application and curing 13 e types and characteristics of adhesive e 7. flux coating 14 e types and characteristics of flux e 8. wave soldering 15 9. soldering and resoldering with a soldering iron 15 10. cleaning 16 6 adjustments and lock painting 17 1. adjustments 17 2. automatic adjustments 18 3. lock painting 19 7 examples of improper application and prevention of the troubles 20 ex.1. poor contact caused by flux adhesion 20 ex.2. cracking of the substrate 21 ex.3. poor contact caused by a deformed driver plate 21 www.datasheet www.datasheet www.datasheet www.datasheet 4u 4u4u 4u .com .com .com .com
r82e2.pdf 97.09.29 2 this is the pdf file of catalog no.r82e-2. 1 features and specifications murata supplies various types of chip trimmer potentiometers which are designed for various purposes. poz3 series this series is designed for automatic resistance adjustments. manual adjustments are also possible and its handling is easy. since metal plate terminals are employed, the possibility of solder leaching is eliminated and virtually no peeling- off of electrodes occurs even if the pcb warps. its gold plating ensures high solderability. the poz3kn series has a flat surface to facilitate pick-up by a chip placer. 1. features of murata chip trimmer potentiometers rvg3s08 (for reflow soldering) driver plate wiper resistive element (carbon) resin substrate terminal (3) terminal (1) terminal (2) poz3an (top adjustment type for reflow soldering) poz3kn (rear adjustment type for reflow soldering) driver plate wiper terminal (2) resistive element (carbon) resin substrate terminal (3) terminal (1) driver plate wiper stopper terminal (2) resistive element (cermet) ceramic substrate terminal (3) terminal (1) stopper rvg3 series this series is designed for automatic resistance adjustments. manual adjustments are also possible and its handling is easy. the plated electrodes prevent solder leaching. the rvg3s08 series is provided with a stopper to prevent the driver plate from turning beyond the electrically effective range (or to prevent the wiper from becoming electrically open). www.datasheet www.datasheet www.datasheet www.datasheet 4u 4u4u 4u .com .com .com .com
r82e2.pdf 97.09.29 3 this is the pdf file of catalog no.r82e-2. 1 features and specifications rvg4m series the electrodes are plated to minimize solder leaching. since the structure is hermetically sealed, flux cleaning (removal) after soldering is not necessary. resin coating after adjustment is possible. rvg4m (for flow and reflow soldering) driver plate wiper terminal (2) resistive element (cermet) ceramic substrate terminal (3) terminal (1) rvg3a08 (for flow and reflow soldering) driver plate wiper rubber terminal (2) ceramic substrate resistive element (cermet) terminal (3) terminal (1) gear case adjustment screw terminal (2) terminals(1) and (3) resistive element(cermet) ceramic substrate wiper pog5 (for reflow soldering) pog5 series since metal plate terminals are employed, the possibility of solder leaching is eliminated and virtually no peeling- off of electrodes occurs even if the pcb warps. since the structure is hermetically sealed, flux cleaning (removal) after soldering is not necessary. resin coating after adjustment is possible. it features compactness and provides high resolution with 11 turns. it is easy to make fine adjustments. www.datasheet www.datasheet www.datasheet www.datasheet 4u 4u4u 4u .com .com .com .com
r82e2.pdf 97.09.29 4 this is the pdf file of catalog no.r82e-2. 1 features and specifications 2. specifications cermet carbon triangular 3 (divider type) ] 1 automatic manual reflow soldering flow soldering gold plating(nickel undercoating) solder plating (nickel undercoating) ] 3 ] 3 ] 3 ] 3 solder plating (copper undercoating) 3 mm square 4 mm square 5 mm square 1.50mm 1.85mm 2.00mm 2.10mm 3.70mm 5.00mm 0.040g(40mg) 0.080g(80mg) 0.180g(180mg) necessary ] 2 not necessary possible not possible 250 pcs./reel 500 pcs./reel 1500 pcs./reel 2000 pcs./reel 2500 pcs./reel poz3 series rvg3 series rvg4m series pog5 series poz3an rvg3s08 rvg3a08 RVG4M08 rvg4m58 pog5an pog5hn item series resistive element material terminal layout no. of terminals adjustment method soldering electrode surface treatment size product thickness product weight cleaning lock painting taping packaging (reel with a diameter of 180 mm) ] 1 they can be used as the rheostat type by connecting lands (2) and (3). (2 terminals (rheostat t ype) ) ] 2 cleaning is needed only when there is an adhesion of foreign matter such as flux on the resistive element. ] 3 only terminal (2) is gold-plated with a nickel undercoat. (1) (3) (2) poz3kn (1) (2) www.datasheet www.datasheet www.datasheet www.datasheet 4u 4u4u 4u .com .com .com .com
r82e2.pdf 97.09.29 5 this is the pdf file of catalog no.r82e-2. 1. precautions in storage 2 storage to ensure the solderability of the terminals, murata chip trimmer potentiometers are plated as shown in the table on the right. however, if they should be stored in a hot, humid atmosphere or in an atmosphere which is contaminated with sulfur or chlorine gas, the external surfaces of the terminals might be oxidized or sulfated, causing a deterioration in solderability. to prevent this, the following storage conditions should be met. storage environment make sure that the ambient temperature is below 40?c and the relative humidity is below 70%rh. the atmosphere should not contain sulfur and chlorine gases. storage method don't open the minimum package until just before use. after the package is opened, it should be sealed again by heating or stored in a desiccator. (when resealing the package, never use a rubber band.) storage period stored products should be used within six months. if you are going to use a product which has been stored for more than six months, check its solderability beforehand. c electrode surface treatment series electrode surface treatment poz3 gold plating (nickel undercoating) rvg3 terminals (1) & (3): solder plating (nickel undercoating) rvg4m terminal (2) : gold plating (nickel undercoating) pog5 solder plating (copper undercoating) www.datasheet www.datasheet www.datasheet www.datasheet 4u 4u4u 4u .com .com .com .com
r82e2.pdf 97.09.29 6 this is the pdf file of catalog no.r82e-2. 3 design of printed circuit boards 1. considerations in design to mount chip trimmer potentiometers on a pcb, it is necessary to design land patterns. in designing land patterns, take the following points into consideration. land pattern area if the land pattern area is too large, a positional error can easily occur due to the solder? surface tension. if the area is too small, the required solder adhesive strength will not be obtained. to prevent this type of trouble, please use our standard land patterns. both side chip mounting if the mounting process includes reflow soldering for the upper side of the pcb and flow soldering for its lower side and a product is mounted on the upper side by reflow soldering without cleaning, take the following cautions in order to prevent the flux from flowing onto the wiper sliding surface: q don't place the product within 10 mm from the outer edge of the pcb. w don't provide a through hole near the product. (a distance of 10 mm or more between the product and a through hole is necessary.) other considerations q self-alignment w solder adhesive strength 2. standard land patterns (1) (3) (2) 3.1 1.0 0.75 1.0 0.75 2.4 0.1 3.2 3.6 0.5 0.1 1.15 2.2 3.0 1.85 0.1 0.25 0.1 0.1max. 0.7 0.7 1 4 0.9 1.9 0.9 1.0 0.7 1.0 1.1 (2) (1) (3) 3.8 poz3an 10 mm or more 10 mm or more 10 mm or more through hole l pcb layout standard tolerance: f 0.1 ( in mm ) standard tolerance: f 0.3 ( in mm ) www.datasheet www.datasheet www.datasheet www.datasheet 4u 4u4u 4u .com .com .com .com
r82e2.pdf 97.09.29 7 this is the pdf file of catalog no.r82e-2. 3 design of printed circuit boards 0.5 0.1 (2) (1) (3) 5.4 4.4 1.1 1.15 2.2 3.0 part to be soldered 0.85 0.9 0.85 2.4 0.1 3.2 3.1 2.1 1.85 0.1 0.25 0.1 0.5 0.1 3.9 1.0 (2) 3.0 2.3 0.1 1.2 3.0 4.1 1 0.85 0.3 0.1 1.5 1.25 1.1 (3) (1) 1.1 1.75 0.8 1.5 part to be soldered (0.3) 1.1 0.7 0.7 1 2 1 driver plate rotation area rvg3s08 #2 #3 clockwise #1 (1) (2) (3) 3.0 2.4 0.1 0.5 0.1 3.5 1.2 0.7 1.1 0.7 3.0 2.2 1.85 0.1 0.3 0.1 0.7 90 0.65 1.5 1.1 1.75 (0.3) 0.6 0.7 1 4 4.6 2.2 1.5 0.8 1.1 1.1 1.6 (2) (1) (3) 0.9 4.6 2.2 1.5 0.8 1.1 1.1 1.6 (2) (1) (3) 0.9 poz3kn 0.5 1.25 3.0 6.0 1.0 1.0 1.25 1.5 (2) (1) (3) 3.0 e 0 rvg3a08 standard tolerance: f 0.3 ( in mm ) standard tolerance: f 0.1 ( in mm ) standard tolerance: f 0.1 ( in mm ) standard tolerance: f 0.1 ( in mm ) standard tolerance: f 0.3 ( in mm ) standard tolerance: f 0.3 ( in mm ) www.datasheet www.datasheet www.datasheet www.datasheet 4u 4u4u 4u .com .com .com .com
r82e2.pdf 97.09.29 8 this is the pdf file of catalog no.r82e-2. 3 design of printed circuit boards (1) (2) (3) 4.0 2.7 0.1 (2.4) 4.7 2.0 0.2 0.7 0.75 0.55 0.1 0.35 0.1 depth 0.6 0.8 1.5 2.4 (0.3) 0.85 1.8 0.85 1.7 3.8 1.5 14 m 1.7 (2) (1) (3) 1.8 1.6 1.1 1.1 1.2 3.2 6.4 2.6 1.2 2.4 : 1.5 : 0.6 : 0.5 diameter slot width slot depth 5.0 3-0.8 3-0.7 3-0.9 0.5 electric adjustment section 0.2 3.9 2.5 3.5 4.8 (1) (3) (2) 1.2 2.4 3-0.7 0.5 2.6 4.9 3.7 3-0.8 3-0.9 2.3 4.8 (1) (3) (2) 1.5 0.6 0.5 diameter : slot width : slot depth : electric adjustment section pog5antype pog5hntype RVG4M08/58 2.5 2.9 3-1.3 3-1.6 (1) (3) (2) 3-1.3 3-1.6 4.0 2.3 (1) (3) (2) standard tolerance: f 0.3 ( in mm ) standard tolerance: f 0.3 ( in mm ) standard tolerance: f 0.3 ( in mm ) standard tolerance: f 0.1 ( in mm ) standard tolerance: f 0.1 ( in mm ) standard tolerance: f 0.1 ( in mm ) www.datasheet www.datasheet www.datasheet www.datasheet 4u 4u4u 4u .com .com .com .com
r82e2.pdf 97.09.29 9 this is the pdf file of catalog no.r82e-2. 4 typical chip mounting processes typical chip mounting processes as listed below are available. it should be noted that the mounting procedures, soldering method and standard land pattern vary depending on the process employed. 1. one side chip mounting 2. both side chip mounting 3. mixed mounting of chip components and leaded components reflow soldering system flow soldering system one side reflow/ one side flow system both side reflow system pcb check pcb reversing insertion of leaded components adhesive application chip placing pcb reversing flow soldering adhesive setting flux application inspection cleaning solder paste stenciling chip placing reflow soldering check pcb solder paste stenciling chip placing check reflow soldering cleaning pcb adhesive application chip placing check flux application adhesive setting pcb reversing flow soldering cleaning inspection inspection cleaning inspection pcb reversing check pcb solder paste stenciling chip placing check reflow soldering adhesive application pcb reversing adhesive setting flow soldering flux application chip placing cleaning inspection pcb solder paste stenciling adhesive application chip placing check pcb reversing reflow soldering solder paste stenciling chip placing check reflow soldering www.datasheet www.datasheet www.datasheet www.datasheet 4u 4u4u 4u .com .com .com .com
series standard applying thickness poz3an, rvg3a, rvg4m, pog5 150 e 200 m m poz3kn 100 e 150 m m r82e2.pdf 97.09.29 10 this is the pdf file of catalog no.r82e-2. 5 chip mounting process 1. solder paste stenciling the amount of solder paste according to the figure on the right, apply the appropriate amount of solder paste with a stencil so that the solder covers the side face of the electrode. if the amount of solder paste applied to the land is insufficient, the required adhesive strength cannot be obtained. if an excessive amount of solder paste is applied, solder bridging or flux overflow to the resistive element surface can occur. standard thicknesses of solder coating are listed in the table on the right. 2. mounting the product when mounting the product, pay attention to the following points. dimensions of the positioning claws in chip placers which mechanically determine the pick- up position, check the dimensions of the positioning claws, referring to the figure on the right. the width of each claw should be such that it cannot be inside the space between terminals (1) and (3). if it is inside the space between them, the product may get out of place or air leakage may occur. solder electrode 2.5?.8mm 2.0mm recommended for the poz3 and rvg3 series 4.0mm 2.0mm recommended for the rvg4m and pog5 series claw claw product t= 2.0 mm or more a nozzle whose suction surface is flat and free of notches or v grooves is recommended. product w= 4.0 mm or more correct w claw incorrect terminal (1) terminal (3) l width of the positioning claws l recommended thickness of the positioning claws dimensions of the pick-up nozzle the size of the pick-up nozzle should fit the suction surface of each product. there are two nozzle types as shown on the right in the figure. use the suitable type for each series as indicated here. pressure the pressure from the pick-up nozzle should be 100 gf to 300 gf of static load. www.datasheet www.datasheet www.datasheet www.datasheet 4u 4u4u 4u .com .com .com .com
r82e2.pdf 97.09.29 11 this is the pdf file of catalog no.r82e-2. 5 chip mounting process c position detection methods employed by various commercial chip placers 3. compatibility with chip placers when using commercial chip placers the table on the right shows detection methods for pick- up nozzle positioning which are employed by typical commercial chip placers. when a chip placer of group a or b as listed in the table is used to mount the product, sensor level (judgment criteria) adjustment is necessary. for the pulsar 100 series of group a, removal of the nozzle clogging detection circuit is needed. for further information, please consult the manufacturer of the chip placer. for chip placers of group c or d, sensor level adjustment is unnecessary. if you are going to use a chip placer of group d for the poz3 and rvg3a08 series, please consult us. for the sensor level adjusting procedure, see the next paragraph, "4. sensor level adjustment". series tape width pitch rvg4m 12mm 8mm poz3an , rvg3 0 8mm 4mm poz3kn 12mm 4mm pog5an 16mm 12mm pog5hn 12mm 8mm manufacturer typical model detection method a pulsar 100 series 120c, 140c, 135c panasert mic, mid, ma, mf ecm series ocm-8000 series am100 series ckd panasonic mamiya electronics okano electric matsushita electric works cm-60f, -62f, -60p, -62p, -92p kyushu matsushita electri c vacuum sensor system b vacuum sensor d photocell system tcm-40 , -41 , -60 sanyo panasert mk 1 1 , mk 2 2 , mkh, mq, mq1, mq2 panasonic c photocell (line sensor) system d image processing (ccd camera) system bulser 200 series ckd panasert msh, msh- 2 2 , mv 2 2 , mv 2 2 -f, mpa-v panasonic tcm-1000, -1200, -3000 sanyo cp-6, cp 4 4 -3 fuji machinery cm86c, 85c, 82c kyushu matsushita electric adjustment of the pick-up nozzle bottom dead point if the bottom dead point of the pick-up nozzle is too low, an excessive force would be applied to the product, causing a decrease in torque, deformation of the driver plate or a crack in the pcb. also, if dust is collected in the gap between the pick-up nozzle and cylinder inner wall, the nozzle would fail to move smoothly and thus cause an excessive force to be applied to the product, resulting in a similar type of trouble. precautions in mounting the product in the poz3, rvg3 and rvg4m series, some air leak will inevitably occur during pick-up. therefore, if the chip placer is equipped with a vacuum sensor system, the acceptance level for air leaks as judgment criteria must be adjusted beforehand. unless this adjustment is made properly, the chip placer might fail to function. (for the adjusting procedure, see "4. sensor level adjustment". ) for the poz3kn series, use a chip placer which incorporates an image processing system to prevent deformation of terminals. (see the next paragraph, "compatibility with chip placers".) taping versions taping versions of products are available as listed in the table on the right. www.datasheet www.datasheet www.datasheet www.datasheet 4u 4u4u 4u .com .com .com .com
r82e2.pdf 97.09.29 12 this is the pdf file of catalog no.r82e-2. 5 chip mounting process adjusting procedure a sensor level adjustment should be made as follows: q check to see if the detection circuit has one sensor line or more. (see the figure on the right.) w according to the figure on the right, attach a vacuum gauge (for example, bourdon tube) in a specified manner which depends on the circuit layout. e read the vacuum pressure (p1) while nothing is being picked up (the nozzle is open). example: p1= e 30 mmhg r have the product picked up and read the vacuum pressure (p2) at this moment. example: p2= e 90 mmhg if the chip placer is provided with positioning claws, the claws should be held in their closed positions during pick-up. if the vacuum pressure varies depending on whether the claws are open or closed, the timing of their closing may be incorrect. please recheck it. t using a control (variable resistor), adjust the vacuum pressure (px) at which the vacuum sensor pilot lamp switches on or off, so that the condition of p2 < px < p1 is met. example: px= e 70 mmhg now the whole sensor level adjustment procedure is completed. when the detection circuit has a single sensor line, note that standing-up of the chip cannot be detected in case of small components (2.0 (l) g 1.25 (w) mm, 3.2 (l) g 1.6 (w) mm). 4. sensor level adjustment vacuum vacuum gauge pick-up nozzle double-line circuit vacuum sensor for rectangular chips vacuum sensor for special shape chips changeover valve vacuum vacuum sensor vacuum gauge pick-up nozzle single-line circuit vacuum pump product positioning claws l chip placer positioning claws claws not provided claws provided 5. reflow soldering soldering conditions if the soldering temperature is too high or the soldering time is too long, leaching of terminations, a drop in torque or a rise in contact resistance might occur. to prevent this, set the optimum soldering conditions, referring to the graph on the right. if the soldering temperature is too low or the soldering time is too short, the solder would not melt thoroughly and its adhesive strength would be weak. l standard soldering conditions 60?120 sec. 30 sec. or less 100 0 200 230 preheating (in the air) soldering gradual cooling (in the air) temperature (solder melting zone) (?c) www.datasheet www.datasheet www.datasheet www.datasheet 4u 4u4u 4u .com .com .com .com
r82e2.pdf 97.09.29 13 this is the pdf file of catalog no.r82e-2. 5 chip mounting process the amount of adhesive to be applied application of an excessive amount of adhesive might unfavorably affect the solderability. on the other hand, if the amount of adhesive applied is insufficient, the product might come off during soldering. viscosity of adhesive if the viscosity of adhesive is too low, a slip in the product placed on the pcb would easily occur. use adhesive whose viscosity is 500 ps or more at 25?c. points of application adhesive should be applied to two points more than 0.3mm away from the land as shown on the right in the figure, in a manner that it can not protrude through the center hole of the product and stick to the wiper. control of adhesive curing if the adhesive applied does not cure well, the adhesive strength would be weak, which might cause peeling-off of the product during soldering. to prevent this, the curing temperature and time should be controlled properly depending on the type of adhesive. 6. adhesive application and curing adhesive pcb land 2-point application 0.3 mm or more 0.3 mm or more c standard amounts of adhesive applied typical adhesives standard amounts of application mr-8153ra 0.6 e 0.9mg nf-3000 0.8 e 1.1mg (1) types of adhesive commercial adhesives for mounting chips temporarily are broadly divided into three types. q acrylic ultraviolet ray curing type w polyester ultraviolet ray curing type e epoxy thermosetting type commonly used commercial adhesives are listed on the next page in the table. (2) required characteristics of adhesive q when a dispenser is used, a stable discharge of adhesive should be ensured free from trails of thready adhesive. w the adhesive should not loosen easily after it is applied to the pcb. e the adhesive should be viscous enough to prevent the product from getting out of place due to vibration or movement of the pcb caused by the chip placer. r high heat resistance and high adhesive strength at high temperatures. t high insulation resistance and excellent moisture resistance. (3)adhesive application methods the following three adhesive application methods are available. select the most suitable method, taking the product mounting method, mounting speed, production volume and other related factors into consideration. application method features dispenser a sequential application method which allows control of the amount of adhesive according to the type and shape of components. a system in which adhesive is applied at a stroke through a screen. this method can save time required for application, though it requires set-up change when pcbs are changed. in this method, no coating is allowed after components are mounted. transfer pin the application of adhesive is completed at once with transfer pins. the amount of adhesive cannot be controlled in this method. types and characteristics of adhesive screen printing www.datasheet www.datasheet www.datasheet www.datasheet 4u 4u4u 4u .com .com .com .com
r82e2.pdf 97.09.29 14 this is the pdf file of catalog no.r82e-2. 5 chip mounting process name mr-8153ra nf-1000-6r nf-3000 ju-8v ju-8vd jt-5s ultradyne # 5111 ultradyne # 5111-w5 ingredients acrylic resin ] polyester resin ] epoxy acrylate resin ] epoxy resin ] epoxy resin ] viscosity 5500ps 1800ps 2200ps(h) 1800ps(m) 1300ps(l) 400ps 200ps 500ps 1300ps ] single liquid type curing temp. and time uv 10" 150 ?c 10"min. uv 10 e 15" 140 e 150 ?c 10"min. uv 10 e 15" 140 e 150 ?c 30"min. uv 10 "min. 140?c 10 "min. 140 ?c 2.5'min. 130?c 15' pot life 2 mos.(30?c) 3 mos.(20?c) 1 mos.(20?c) 3 mos.(20?c) 1.5 mos.(20?c) application method dispenser screen printing a a ??? ??? ??? a a a a ??? a a 7. flux coating flux may be coated only on the rvg3a08 and rvg4m series, for which flow soldering is used. coating thickness if the coating of flux is too thick, a lot of gas would be generated from the flux, which might unfavorably affect the solderability. make sure that a uniform, thin coating of flux is formed. foam type flux coating is commonly used for flow soldering. ingredients if the flux contains a high percentage of chlorine (and cleaning has not been done sufficiently), the functionality of the product could be unfavorably affected. it is advisable to use a rosin-based flux which does not contain more than 0.2wt% of chlorine. c commercial chip mounting adhesives (1) functions of flux flux is used to increase solderability. its functions are as follows: q removing oxides in the base metal w preventing oxidization during heating e decreasing the surface tension of solder (2) types of flux there are two types of flux: q rosin flux w mildly activated flux (3) cautions in use q rosin flux may be used usually without cleaning. w in case of mildly activated flux, if the chlorine content is too high, corrosion in external terminations or electrodes might occur due to the chlorine. for this reason, flux with a chlorine content of less than 0.2wt% should be used. (4) typical commercial flux flux name chlorine content cf-210v 0.08wt% cf-220v 0.09wt% gx-15t 0.09wt% agf-150x 0.10wt% gammalux d-350 0.08wt% types and characteristics of flux www.datasheet www.datasheet www.datasheet www.datasheet 4u 4u4u 4u .com .com .com .com
r82e2.pdf 97.09.29 15 this is the pdf file of catalog no.r82e-2. 5 chip mounting process 60?20 sec. 5 sec. or less 100 0 200 250 preheating (in the air) soldering gradual cooling (in the air) temperature (?c) flow soldering can be used only for the rvg3a08 and rvg4m series, but not for the poz3, rvg3s08 and pog5 series. soldering conditions if the soldering time is too long or the soldering temperature is too high, consistent product properties could not be maintained. standard soldering conditions should be observed. 8. flow soldering l standard soldering conditions terminations direction of move this part tends to remain unwet. pcb product solder flow 9. soldering and resoldering with a soldering iron when carrying out hand soldering with a soldering iron, be careful that the tip of the iron is not excessively hot. if the temperature of the tip is too high, the properties of the product might deteriorate. for the poz3 and pog5 series, which use a resin substrate or case, special attention should be paid to the temperature of the soldering iron tip. care should be taken not to touch any part other than terminals with the soldering iron. soldering conditions when newly soldering or resoldering the product, observe the following conditions : soldering iron tip temperature : 260?c or less soldering iron tip diameter : 2 mm or less (1 mm for the tip end) soldering iron wattage : 30 w or less soldering time : 3 sec. or less soldering iron product land pcb correct incorrect cautions in soldering attention should be paid to the soldering conditions to ensure that the terminations of the product are soldered properly. for the rvg3a08 series, the flux left on the surface of the resistive element or the wiper should be removed completely after flow soldering. www.datasheet www.datasheet www.datasheet www.datasheet 4u 4u4u 4u .com .com .com .com
r82e2.pdf 97.09.29 16 this is the pdf file of catalog no.r82e-2. 5 chip mounting process use ethyl alcohol or isopropyl alcohol as a cleaning solvent. for the use of other types of cleaning solvents, consult us beforehand. cautions in cleaning the cautions to be taken in cleaning somewhat depends on the series. for the rvg4m and pog5 series, which have a hermetically sealed structure, special considerations as described below are needed. pog5 series observe the following cleaning conditions: q dipping, steam or ultrasonic cleaning time should not be more than 3 min. w for ultrasonic cleaning, observe the following conditions: output: 600w (67 liters) or less frequency: 28 khz temperature: room temperature (5?0?c) rvg4m series to maintain the hermetically sealed structure, observe the recommended cleaning time for each method as shown in the table on the right. 10. cleaning c recommended cleaning time range for the rvg4m series poz3 and rvg3 series in these series, the wiper and resistive element are exposed so flux residue should be removed completely. any flux residue might damage the functionality of the product. for flow soldering of the rvg3a08 series, cleaning for flux residue removal is indispensable. the cleaning conditions vary depending on the type and volume of flux applied. determine the optimum cleaning conditions for each application, referring to the above table for the rvg4m series. the prescribed conditions for ultrasonic cleaning (output 20w/ r or less, cleaning time 1 min. or less) should be strictly observed to avoid a breakdown of the product due to metal fatigue. room hot dipping ultrasonic steam temperature (below 20w/ r ) cleaning dipping conditions method 1 5 min. or less method 2 2 min. or less method 3 1 min. or less method 4 1 min. or less method 5 1 min. or less 30 sec. or less 30 sec. or less 1 min. or less (30 sec. or less recommended ) www.datasheet www.datasheet www.datasheet www.datasheet 4u 4u4u 4u .com .com .com .com
r82e2.pdf 97.09.29 17 this is the pdf file of catalog no.r82e-2. 6 adjustments and lock painting 1. adjustments the following points should be taken into account when the resistance is adjusted with an adjuster inserted into the product. adjuster and load if an excessive load is applied to the resistance adjuster, the driver plate or wiper might deform or the pcb might crack. therefore, the load applied should not be more than 4.9 n (500 gf), preferably below 100 gf. inspection of the adjuster if the adjuster does not fit the adjuster slot in the product or if its tip is worn, adjustments will not be easy. an adjuster with a worn tip would not engage in the slot properly. check the tip periodically. range of rotation of the adjuster the poz3, rvg3a08 and rvg4m series have no stopper mechanism to prevent an excessive driver plate rotation. if the driver plate is turned beyond the electrically effective range, the circuit between terminals (1) and (2) and that between terminals (2) and (3) will open. the whole circuitry should be carefully designed so that it can not be irrevocably damaged even if this occurs. please note that the product s functionality may be damaged if the plate is turned beyond the electrically effective range repeatedly. types of adjuster for automatic adjustments of the poz3, rvg3s08 and rvg3a08 series, we recommend a bit for adjusters. (see the next paragraph, "2. automatic adjustments".) c recommended adjusters for manual adjustments recommended adjusters series manufacturer trade name murata's trade name head shape vessel mfg. no.9000 d 1.7 g 30 kmpot12v cross poz3 toray toray torayceram adjuster sa-2225 kmpot13t flat blade industries, inc. (semicircular end) vessel mfg. no.9000 d 1.7 g 30 kmpot12v cross rvg3s08/3a08 toray toray torayceram adjuster sa-2225 kmpot13t flat blade industries, inc. (semicircular end) rvg4m vessel mfg. no.9000 e 2.6 g 30 kmpot15v flat blade pog5 vessel mfg. no.9000 e 1.3 g 30 kmpot16v flat blade futaba tool mfg. da54 flat blade www.datasheet www.datasheet www.datasheet www.datasheet 4u 4u4u 4u .com .com .com .com
r82e2.pdf 97.09.29 18 this is the pdf file of catalog no.r82e-2. 6 adjustments and lock painting 2. automatic adjustments in the poz3, rvg3s08 and rvg3a08 series, an adjusting bit can be used for easy automatic adjustments. guiding mechanism for position error correction after being soldered, the product may be slightly out of place because of land pattern errors or slippage during soldering. such positional errors can be corrected by installing an image sensor, but this method involves problems about the installation cost and correction speed. as an alternative solution, provision of a "guiding mechanism" on the product or adjusting bit is recommended. this ensures low installation cost and quick correction. a guiding mechanism for automatic positional error correction is formed by an adjusting bit combined with the poz3, rvg3s08 or rvg3a08 series. as shown in the figure on the right, the product position can be corrected by up to f 0.7 mm in both the x and y directions. 1.0 5 20 1.0 0.7 1.5 2.2 r1.20 f 0.05 0.40 d 0.05 e 0.03 (in mm) l toray torayceram adjuster jb-2225 dimensions for further information on dimensions, contact toray industries, inc. bit for automatic adjustment (jb-2225) product pcb pcb actual position design position (offset from the bit center) 0.7mm errors up to f 0.7 mm correctable c recommended adjuster bit for automatic adjustment recommended bit for automatic adjustments we recommend toray torayceram adjuster jb-2225 (our trade name : kmpot31t) as a bit for the above-mentioned adjustment purpose. made of zirconia ceramics, it is highly resistant to abrasion. also, since it is electromagnetically non-inductive and electrically non-conductive, it can be used in the high frequency range. series recommended adjuster bit manufacturer trade name murata's trade name head shape poz3 rvg3s08 toray toray torayceram adjuster jb-2225 kmpot31t flat blade rvg3a08 (semicircular end) www.datasheet www.datasheet www.datasheet www.datasheet 4u 4u4u 4u .com .com .com .com
r82e2.pdf 97.09.29 19 this is the pdf file of catalog no.r82e-2. 6 adjustments and lock painting 3. lock painting lock paint can be coated on the rvg4m and pog5 series (sealed type). if a product of a series other than the rvg4m and pog5 series needs to be painted, be sure to consult us beforehand. paint ingredients lock paint should not contain ingredients which harm the material of the product such as chlorine and sulfur. before application of lock paint, consult us. www.datasheet www.datasheet www.datasheet www.datasheet 4u 4u4u 4u .com .com .com .com
r82e2.pdf 97.09.29 20 this is the pdf file of catalog no.r82e-2. 7 examples of improper application and prevention of the troubles chip trimmer potentiometers are relatively complicated structural parts with contacts. after being soldered to the pcb, they need adjustments. therefore, improper handling of the product can cause it to malfunction. various types of trouble caused by improper handling as well as means to prevent such trouble are explained next. phenomenon the contact between the resistive element and wiper is unstable due to adhesion of flux. as a result, adjustment of resistance is not easy. (this type of trouble will not occur in the rvg4m and pog5 series since they are of the sealed type.) prevention take the measures described below to prevent flux from adhering to the resistive element or wiper: q when the product is to be mounted on the front side of the pcb by reflow soldering while flow soldering is to be used on the back side, the arrangement of components and through holes should be carefully determined or the dimensions of land patterns should be decreased in the pcb design process. (see "3.design of printed circuit boards".) w decrease the thickness of solder paste coating and reduce the flux content. e when a soldering iron is used, use thread solder which has a v slot or a perforation to prevent splashing of flux. the amount of solder applied should be minimized. if splashing of flux cannot be prevented, cleaning or switching to the sealed type should be considered. ex.1. poor contact caused by flux adhesion 10 mm or more 10 mm or more 10 mm or more through hole l pcb layout www.datasheet www.datasheet www.datasheet www.datasheet 4u 4u4u 4u .com .com .com .com
r82e2.pdf 97.09.29 21 this is the pdf file of catalog no.r82e-2. 7 examples of improper application and prevention of the troubles phenomenon there is a crack in the substrate of the product, its resistance cannot be adjusted and the circuit becomes open. prevention to prevent an excessive load to the substrate in the process of cutting units off the pcb stock or during resistance adjustment, take the cautions described below. when each unit is to be taken from pcb stock, measures q and w as described below are effective in eliminating or reducing warping of the pcb. q to facilitate the cutting process to reduce warping, an adequate perforation or sufficiently large slits or v slots should be provided. w it is advisable to use the cutting method instead of the bending method to break the pcb stock into units. e to avoid the application of an excessive load with an adjuster, the specified adjustment procedure should be observed. (see "6.1 adjustments".) ex.2. cracking of the substrate phenomenon the driver plate is deformed, so adjustment is not easy. the wiper is also deformed so the contact between the wiper and resistive element is defective. prevention to prevent an excessive load to the driver plate during transportation of the product or resistance adjustment, take the cautions described below. q make sure that there is no possibility of a load being directly applied to the product during the pcb transportation. for example, transportation methods which may give a strong impact or stress to the driver plate such as stacking of pcbs or the use of a chute should be avoided. w to avoid the application of an excessive load with an adjuster, the specified adjustment procedure should be observed. (see "6.1 adjustments".) ex.3. poor contact caused by a deformed driver plate perforation slit v slot www.datasheet www.datasheet www.datasheet www.datasheet 4u 4u4u 4u .com .com .com .com
note: 1. export control < for customers outside japan > murata products should not be used or sold for use in the development, production, stockpiling or utilization of any convention al weapons or mass-destructive weapons (nuclear weapons, chemical or biological weapons, or missiles), or any other weapons. < for customers in japan > for products which are controlled items subject to the foreign exchange and foreign trade control law of japan, the export l icense specified by the law is required for export. 2. please contact our sales representatives or engineers before using our products listed in this catalog for the applications r equiring especially high reliability what defects might directly cause damage to other party's life, body or property (listed below) or for other applications not specif ied in this catalog. q aircraft equipment w aerospace equipment e undersea equipment r medical equipment t transportation equipment (automobiles, trains, ships,etc.) y traffic signal equipment u disaster prevention / crime prevention equipment i data-processing equipment o applications of similar complexity or with reliability requirements comparable to the applications listed in the above 3. product specifications in this catalog are as of september 1997, and are subject to change or stop the supply without notice. please confirm the specifications before ordering any product. if there are any questions, please contact our sales representatives or engineers. 4. the categories and specifications listed in this catalog are for information only. please confirm detailed specifications by checking the product specification document or requesting for the approval sheet for product specification, before ordering. 5. please note that unless otherwise specified, we shall assume no responsibility whatsoever for any conflict or dispute that ma y occur in connection with the effect of our and/or third party's intellectual property rights and other related rights in consideration of your using our products a nd/or information described or contained in our catalogs. in this connection, no representation shall be made to the effect that any third parties are authori zed to use the rights mentioned above under licenses without our consent. 6. none of ozone depleting substances (ods) under the montreal protocol is used in manufacturing process of us. head office 2-26-10, tenjin nagaokakyo-shi, kyoto 617-8555, japan phone:81-75-951-9111 marketing group 1874 sumiyoshi-cho kizuki, nakahara-ku kawasaki, 211-0021, japan phone:81-44-422-5153 fax:81-44-433-0798 http://www.murata.co.jp/ r82e2.pdf 97.09.29 this is the pdf file of catalog no.r82e-2. www.datasheet www.datasheet www.datasheet www.datasheet 4u 4u4u 4u .com .com .com .com

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